Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging
文献类型：期刊论文
| 作者 | P. J. Shang ; Z. Q. Liu ; D. X. Li ; J. K. Shang |
| 刊名 | Philosophical Magazine Letters
 |
| 出版日期 | 2011 |
| 卷号 | 91期号:6页码:410-417 |
| 关键词 | diffusion intermetallic compounds SnIn solder interfaces Kirkendall void cu-sn interface reliability diffusion systems growth |
| ISSN号 | 0950-0839 |
| 中文摘要 | Microstructural investigations were performed on the interfacial reactions between eutectic SnIn solder and Cu substrate during reflowing at 433 K and solid-state aging at 373 K. Cu(2)(In,Sn) was identified as the only intermetallic compound (IMC) at the interface, which consists of two sublayers with different morphology, a fine-grained sublayer at the Cu side and a coarse-grained sublayer at the solder side. During solid-state aging, voids were found between these two Cu(2)(In,Sn) sublayers but not at the substrate interface, which is also attributed to the Kirkendall effect considering the different diffusion fluxes of Sn or In and Cu atoms in different sublayers. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/30642]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | P. J. Shang,Z. Q. Liu,D. X. Li,et al. Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging[J]. Philosophical Magazine Letters,2011,91(6):410-417. |
| APA | P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2011).Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging.Philosophical Magazine Letters,91(6),410-417. |
| MLA | P. J. Shang,et al."Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging".Philosophical Magazine Letters 91.6(2011):410-417. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。