Tin Whisker Growth on NdSn(3) Powder
文献类型:期刊论文
作者 | H. C. Shi ; A. P. Xian |
刊名 | Journal of Electronic Materials
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出版日期 | 2011 |
卷号 | 40期号:9页码:1962-1966 |
关键词 | Tin whiskers rare earth intermetallic compounds Sn NdSn(3) pb-free solders mechanism |
ISSN号 | 0361-5235 |
中文摘要 | Tin whiskers grew rapidly and spontaneously on NdSn(3) powder under atmospheric conditions. By in situ optical microscopy observation, the incubation period of whisker growth was found to be very short, only about 10 min to 30 min, and the whisker growth rate was very high (up to 73 angstrom/s). It is proposed that the strong tendency for whisker growth on NdSn(3) powder indicates that such growth is closely related to decomposition of NdSn(3) under atmospheric conditions. An electron beam irradiation effect on whisker growth was also observed, in which the whiskers cease to grow after observation by scanning electron microscopy (SEM). |
原文出处 | |
公开日期 | 2012-04-13 |
源URL | [http://210.72.142.130/handle/321006/30657] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | H. C. Shi,A. P. Xian. Tin Whisker Growth on NdSn(3) Powder[J]. Journal of Electronic Materials,2011,40(9):1962-1966. |
APA | H. C. Shi,&A. P. Xian.(2011).Tin Whisker Growth on NdSn(3) Powder.Journal of Electronic Materials,40(9),1962-1966. |
MLA | H. C. Shi,et al."Tin Whisker Growth on NdSn(3) Powder".Journal of Electronic Materials 40.9(2011):1962-1966. |
入库方式: OAI收割
来源:金属研究所
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