The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges
文献类型：期刊论文
| 作者 | H. Wang ; D. S. Xu ; R. Yang ; P. Veyssiere |
| 刊名 | Acta Materialia
 |
| 出版日期 | 2011 |
| 卷号 | 59期号:1页码:19-29 |
| 关键词 | Stacking fault tetrahedron Growth Ledge mechanism Molecular dynamics simulations Shockley dipole vacancy clusters quenched gold fcc metals molecular-dynamics glissile dislocations irradiated materials elastic interaction point-defects part i copper |
| ISSN号 | 1359-6454 |
| 中文摘要 | Ledge expansion and the concomitant growth of a stacking fault tetrahedron (SFT) are investigated in Al and Cu by molecular dynamics (MD) simulations by addition of vacancy rods with selected lengths Ledge expansion is largely governed by the site preference of vacancies on the SFT edges resulting in distinct stable ledged SFTs Both edge- and corner-facing ledge configurations may be adopted The growth of SFTs, especially large ones, is controlled by thermal agitation The mobile part of the ledges consists of a dipole of Shockley partials generally oriented in the 60 degrees mixed orientation that move in a thermally activated manner, reflecting a certain core reorganization of the Shockley dipole (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30725]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. Wang,D. S. Xu,R. Yang,et al. The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges[J]. Acta Materialia,2011,59(1):19-29. |
| APA | H. Wang,D. S. Xu,R. Yang,&P. Veyssiere.(2011).The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges.Acta Materialia,59(1),19-29. |
| MLA | H. Wang,et al."The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges".Acta Materialia 59.1(2011):19-29. |
入库方式： OAI收割
来源：金属研究所
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