Scaling of reliability of gold interconnect lines subjected to alternating current
文献类型：期刊论文
| 作者 | M. Wang ; B. Zhang ; G. P. Zhang ; C. S. Liu |
| 刊名 | Applied Physics Letters
 |
| 出版日期 | 2011 |
| 卷号 | 99期号:1 |
| 关键词 | thermal fatigue damage thin metal-films fracture surfaces behavior failure |
| ISSN号 | 0003-6951 |
| 中文摘要 | We present an investigation of damage morphologies of small-scale gold interconnect lines subjected to thermal fatigue strain generated by alternating current. Fractal dimension analysis reveals a general scaling relation between the critical strain range causing thermal fatigue damage and the ratio of the width to the thickness of the metal line. Such the scaling rule may be useful in controlling reliability of the metal interconnect lines subjected to long-term thermal cyclic strain. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3609779] |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30733]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | M. Wang,B. Zhang,G. P. Zhang,et al. Scaling of reliability of gold interconnect lines subjected to alternating current[J]. Applied Physics Letters,2011,99(1). |
| APA | M. Wang,B. Zhang,G. P. Zhang,&C. S. Liu.(2011).Scaling of reliability of gold interconnect lines subjected to alternating current.Applied Physics Letters,99(1). |
| MLA | M. Wang,et al."Scaling of reliability of gold interconnect lines subjected to alternating current".Applied Physics Letters 99.1(2011). |
入库方式： OAI收割
来源：金属研究所
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