Effects of grain growth on interface diffusion in nanostructured Cu
文献类型：期刊论文
| 作者 | Z. B. Wang ; K. Lu ; G. Wilde ; S. V. Divinski |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2011 |
| 卷号 | 64期号:11页码:1055-1058 |
| 关键词 | Nanostructure Surface mechanical attrition treatment Diffusion Interface Grain growth mechanical attrition treatment severe plastic-deformation boundary diffusion surface-layer copper nickel alloy |
| ISSN号 | 1359-6462 |
| 中文摘要 | Considerable grain growth occurred in a nanostructured Cu sample produced by surface mechanical attrition treatment during isothermal annealing at 423 K. The time-dependence of diffusion of (63)Ni in the nanostructured Cu was investigated by the radio-tracer technique. It was shown that the apparent interfacial diffusivity determined by taking into account the grain growth effects was higher by a factor of 10 than the value determined according to the model of stationary interfaces. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30762]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Z. B. Wang,K. Lu,G. Wilde,et al. Effects of grain growth on interface diffusion in nanostructured Cu[J]. Scripta Materialia,2011,64(11):1055-1058. |
| APA | Z. B. Wang,K. Lu,G. Wilde,&S. V. Divinski.(2011).Effects of grain growth on interface diffusion in nanostructured Cu.Scripta Materialia,64(11),1055-1058. |
| MLA | Z. B. Wang,et al."Effects of grain growth on interface diffusion in nanostructured Cu".Scripta Materialia 64.11(2011):1055-1058. |
入库方式： OAI收割
来源：金属研究所
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