Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature
文献类型：期刊论文
| 作者 | F. Yan ; H. W. Zhang ; N. R. Tao ; K. Lu |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2011 |
| 卷号 | 27期号:8页码:673-679 |
| 关键词 | Quantitative structural characterization Cu Dynamic plastic deformation Transmission electron microscopy Convergent beam electron diffraction channel angular extrusion fine grained copper ultra-high strains mechanical-properties thermal-stability rate sensitivity stored energy evolution strength size |
| ISSN号 | 1005-0302 |
| 中文摘要 | A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy (TEM) assisted by convergent beam electron diffraction (CBED) analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries (<15 degrees) that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect Sigma 3 coincidence (60 degrees/< 111 >) up to the maximum angle of 9 degrees. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30808]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | F. Yan,H. W. Zhang,N. R. Tao,et al. Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature[J]. Journal of Materials Science & Technology,2011,27(8):673-679. |
| APA | F. Yan,H. W. Zhang,N. R. Tao,&K. Lu.(2011).Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature.Journal of Materials Science & Technology,27(8),673-679. |
| MLA | F. Yan,et al."Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature".Journal of Materials Science & Technology 27.8(2011):673-679. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。