Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing
文献类型：期刊论文
| 作者 | Q. K. Zhang ; J. Tan ; Z. F. Zhang |
| 刊名 | Journal of Applied Physics
 |
| 出版日期 | 2011 |
| 卷号 | 110期号:1 |
| 关键词 | lead-free solders mechanical-properties interfacial reactions deformation-behavior joints nanoindentation sn metallization toughness cu3sn |
| ISSN号 | 0021-8979 |
| 中文摘要 | In this study, the shear fracture behaviors of the Cu(6)Sn(5) grains at the Sn-4Ag/Cu interface were studied by indentation test; the fracture mechanisms and shear strength were characterized through analyzing the indentation curves and fracture morphologies. Experimental results reveal that shear fractures of the Cu(6)Sn(5) grains occur at the foundation or the center portion, depending on their size and shape, and there are bursts on the force-depth curves corresponding to the fracture. The shear fracture strength of the Cu(6)Sn(5) grains fractured at their center portion is close to the shear strength of the Cu(6)Sn(5) intermetallic compounds, and its average value is about 670 MPa. (C) 2011 American Institute of Physics. [doi:10.1063/1.3603032] |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30901]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. K. Zhang,J. Tan,Z. F. Zhang. Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing[J]. Journal of Applied Physics,2011,110(1). |
| APA | Q. K. Zhang,J. Tan,&Z. F. Zhang.(2011).Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing.Journal of Applied Physics,110(1). |
| MLA | Q. K. Zhang,et al."Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing".Journal of Applied Physics 110.1(2011). |
入库方式： OAI收割
来源：金属研究所
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