Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface
文献类型：期刊论文
| 作者 | Q. K. Zhang ; H. F. Zou ; Z. F. Zhang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2011 |
| 卷号 | 40期号:11页码:2320-2328 |
| 关键词 | Sn-Bi solder Bi segregation interfacial embrittlement substrate alloying reflow temperature tensile strength lead-free solders joints microstructure embrittlement interconnect bismuth ag |
| ISSN号 | 0361-5235 |
| 中文摘要 | In this study, the influences of substrate alloying and reflow temperature on the Bi segregation behaviors at the Sn-Bi/Cu interface were investigated. Cu and Cu-Ag alloys with different Ag contents were reflowed with Sn-Bi solder at 180A degrees C, 200A degrees C or 220A degrees C, and then aged at 120A degrees C for different times. The evolution of their interfacial morphologies during the aging process was observed, and tensile tests of some solder joints were conducted. The experimental results reveal that the Bi atoms that dissolved in the Cu(6)Sn(5) during the reflow process are expelled when the Cu(6)Sn(5) transforms into Cu(3)Sn and then segregate around the Cu(3)Sn/Cu interface, inducing interfacial embrittlement. Alloying the Cu substrate with Ag can alleviate the Bi segregation by suppressing Cu(3)Sn formation and dissolving the Bi atoms in the Cu-Ag substrate; the critical Ag content to eliminate the Bi segregation is about 1 at.% for the interface reflowed at 200A degrees C. For interfaces reflowed at 180A degrees C, the Bi segregation is less serious because less Bi is dissolved in the Cu(6)Sn(5), and 0.6 at.% Ag can eliminate it. Tensile tests demonstrate that the embrittlement will not occur at Sn-Bi/Cu-Ag joints once the Bi segregation is eliminated. Based on this understanding, aging embrittlement of Sn-Bi/Cu solder joints can be prevented by decreasing the reflow temperature and adding a small amount of Ag to the Cu substrate. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30905]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. K. Zhang,H. F. Zou,Z. F. Zhang. Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface[J]. Journal of Electronic Materials,2011,40(11):2320-2328. |
| APA | Q. K. Zhang,H. F. Zou,&Z. F. Zhang.(2011).Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface.Journal of Electronic Materials,40(11),2320-2328. |
| MLA | Q. K. Zhang,et al."Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface".Journal of Electronic Materials 40.11(2011):2320-2328. |
入库方式： OAI收割
来源：金属研究所
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