Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders
文献类型：期刊论文
| 作者 | H. F. Zou ; H. J. Yang ; Z. F. Zhang |
| 刊名 | Materials Chemistry and Physics
 |
| 出版日期 | 2011 |
| 卷号 | 131期号:1-2页码:190-198 |
| 关键词 | Intermetallic compounds Nucleation Interface EBSD interfacial reactions microstructure metallization substrate kinetics ag |
| ISSN号 | 0254-0584 |
| 中文摘要 | During the reflowing procedure, the Cu concentration in the solder affects the coarsening mechanisms of intermetallic compound (IMC) grains. For the Sn3Cu solder, the mean radius of the IMC grains was proportional to the cube root of the reflowing time; while it follows the square root relation with the reflowing time for the SnAgCu and Sn solders. It is proposed that the flux from the substrate was only consumed to coarsen the IMC grains for Sn3Cu solder, while it was separated into two fluxes for the SnAgCu and Sn solders at the reflowing initial procedure. For the Sn3.8Ag0.7Cu/Cu and Sn/Cu couples, the size distribution of the IMC grains well agrees with the modified flux driven ripening (FDR) model when the value of r/(r) is above 1; while it would closely match with Marqusee and Ross analysis when the value of r/(r) is below 1. For Sn3Cu/Cu couple, the size distribution of IMC grains shows good agreement with the FDR model. However, for SnPb/poly-Cu, during the solid-state aging procedure, the mean radius of the IMC grains was proportional to the cube root of the aging time. And the size distribution of IMC grains is well consistent with the FDR model. (C) 2011 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31002]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. F. Zou,H. J. Yang,Z. F. Zhang. Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders[J]. Materials Chemistry and Physics,2011,131(1-2):190-198. |
| APA | H. F. Zou,H. J. Yang,&Z. F. Zhang.(2011).Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders.Materials Chemistry and Physics,131(1-2),190-198. |
| MLA | H. F. Zou,et al."Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders".Materials Chemistry and Physics 131.1-2(2011):190-198. |
入库方式： OAI收割
来源：金属研究所
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