Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples
文献类型：期刊论文
| 作者 | H. F. Zou ; Q. K. Zhang ; Z. F. Zhang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2011 |
| 卷号 | 40期号:7页码:1542-1548 |
| 关键词 | Cu(3)Sn void Cu alloys intermetallic compound (IMC) interfacial reaction free solders mechanisms diffusion strength joints |
| ISSN号 | 0361-5235 |
| 中文摘要 | In the current study, the interfacial microstructures of Sn-Ag/Cu-X alloy (X = Ag, Sn or Zn) couples were investigated. The experimental results confirm that addition of Ag or Zn can effectively suppress the growth of the Cu(3)Sn layer, while addition of Sn accelerates the growth of the Cu(3)Sn layer. Meanwhile, the formation of voids is effectively suppressed by alloying the Cu substrate. The disappearance of voids and the absence of the Cu(3)Sn layer were well explained in terms of the phase diagram and the diffusion flux: the Cu(3)Sn phase is a nonequilibrium phase based on the Sn-Cu-Zn ternary phase diagram, since a high-Zn region is formed at the Cu(6)Sn(5)/Cu-Zn alloy interface; in addition, the high Sn diffusion flux in the Cu(6)Sn(5) can suppress the growth of Cu(3)Sn and the formation of voids. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31003]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. F. Zou,Q. K. Zhang,Z. F. Zhang. Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples[J]. Journal of Electronic Materials,2011,40(7):1542-1548. |
| APA | H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2011).Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples.Journal of Electronic Materials,40(7),1542-1548. |
| MLA | H. F. Zou,et al."Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples".Journal of Electronic Materials 40.7(2011):1542-1548. |
入库方式： OAI收割
来源：金属研究所
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