Effect of Withdrawal Rates on Microstructure and Creep Strength of a Single Crystal Superalloy Processed by LMC
文献类型：期刊论文
| 作者 | C. B. Liu ; J. Shen ; J. Zhang ; L. H. Lou |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2010 |
| 卷号 | 26期号:4页码:306-310 |
| 关键词 | Eutectic Single crystal superalloy Liquid-metal-cooling Withdrawal rate ni-base superalloy solidification |
| ISSN号 | 1005-0302 |
| 中文摘要 | A nickel base single crystal (SC) superalloy was directionally solidified using liquid metal cooling (LMC) process at various withdrawal rates. The microstructure was refined as increasing the withdrawal rate from 3 to 12 mm/min. However, higher withdrawal rate of 15 mm/min induced the formation of stray grains. Size and volume fraction of the eutectics were found to decrease with the increasing in withdrawal rate. After solution heat treatment at 1250 degrees C, un-dissolved eutectic was observed in specimens. High temperature creep rupture life was observed to be very sensitive to the fraction of these remaining eutectics. Creep rupture tests at 1000 degrees C/235 MPa showed that refined microstructure and low fraction of the remaining eutectic lead to significant improvement of the rupture life. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31269]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | C. B. Liu,J. Shen,J. Zhang,et al. Effect of Withdrawal Rates on Microstructure and Creep Strength of a Single Crystal Superalloy Processed by LMC[J]. Journal of Materials Science & Technology,2010,26(4):306-310. |
| APA | C. B. Liu,J. Shen,J. Zhang,&L. H. Lou.(2010).Effect of Withdrawal Rates on Microstructure and Creep Strength of a Single Crystal Superalloy Processed by LMC.Journal of Materials Science & Technology,26(4),306-310. |
| MLA | C. B. Liu,et al."Effect of Withdrawal Rates on Microstructure and Creep Strength of a Single Crystal Superalloy Processed by LMC".Journal of Materials Science & Technology 26.4(2010):306-310. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。