Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern
文献类型：期刊论文
| 作者 | W. Liu ; L. Zhang ; K. J. Hsia ; J. K. Shang |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2010 |
| 卷号 | 26期号:12页码:1143-1147 |
| 关键词 | Wetting Reactive wetting Spreading Solder Thin film pattern Liquid film morphological wetting transitions structured surfaces eutectic snpb films |
| ISSN号 | 1005-0302 |
| 中文摘要 | The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H(2) 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31309]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | W. Liu,L. Zhang,K. J. Hsia,et al. Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern[J]. Journal of Materials Science & Technology,2010,26(12):1143-1147. |
| APA | W. Liu,L. Zhang,K. J. Hsia,&J. K. Shang.(2010).Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern.Journal of Materials Science & Technology,26(12),1143-1147. |
| MLA | W. Liu,et al."Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern".Journal of Materials Science & Technology 26.12(2010):1143-1147. |
入库方式： OAI收割
来源：金属研究所
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