Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films
文献类型：期刊论文
| 作者 | W. Liu ; L. Zhang ; J. K. Shang |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2010 |
| 卷号 | 26期号:3页码:200-205 |
| 关键词 | Dewetting Solder Spalling Film thickness sn technology metallurgy joints pb |
| ISSN号 | 1005-0302 |
| 中文摘要 | The thermodynamic conditions for dewetting of a liquid solder drop on copper thin films were examined under a hot-stage optical microscope in a flowing protective atmosphere. Dewetting of liquid solder was found to depend strongly on the copper film thickness and preceded by spalling of Cu(6)Sn(5) intermetallic compounds. However, the loss of interfacial bonding by spalling was not sufficient to cause immediate dewetting of solder drops if the wetting tip was still strongly bonded to the copper film. By introducing a pinning force on the wetting front, a sufficient condition was found from a force balance analysis for dewetting of the liquid solder drop, in general agreement with the experimental results. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31310]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | W. Liu,L. Zhang,J. K. Shang. Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films[J]. Journal of Materials Science & Technology,2010,26(3):200-205. |
| APA | W. Liu,L. Zhang,&J. K. Shang.(2010).Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films.Journal of Materials Science & Technology,26(3),200-205. |
| MLA | W. Liu,et al."Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films".Journal of Materials Science & Technology 26.3(2010):200-205. |
入库方式： OAI收割
来源：金属研究所
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