中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Copper corrosion and anodic electrodissolution mechanisms in naturally aerated stagnant 0.5 M H(2)SO(4)

文献类型:期刊论文

作者Y. H. Lu ; W. Wang ; H. B. Xu ; X. F. Kong ; J. Wang
刊名Corrosion Science
出版日期2010
卷号52期号:3页码:780-787
关键词Copper Electrochemical impedance spectroscopy (EIS) Corrosion Electrodissolution Chemical redox acidic sulfate-solutions sulfuric-acid electrochemical reduction impedance spectroscopy oxygen reduction disk-electrode reaction model dissolution behavior iron
ISSN号0010-938X
中文摘要Mechanisms of copper corrosion and electrodissolution in naturally aerated, stagnant 0.5 M H(2)SO(4) were investigated by means of electrochemical techniques, compared with deaerated measurements. The role of dissolved oxygen was suggested, and three models were proposed in -0.05 similar to 0.15 V vs. SCE range. Near to corrosion potential, chemical redox between cuprous intermediate and oxygen reduction reaction (ORR) intermediate accelerated copper corrosion, and corrosion rate was controlled by a combined cathodic kinetic-anodic diffusion process. in low and high potential ranges, chemical redox, occurred between cuprous intermediate and oxygen molecule, synergistically accelerated the electrodissolution of copper. (C) 2009 Elsevier Ltd. All rights reserved.
原文出处://WOS:000275309900014
公开日期2012-04-13
源URL[http://210.72.142.130/handle/321006/31348]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
Y. H. Lu,W. Wang,H. B. Xu,et al. Copper corrosion and anodic electrodissolution mechanisms in naturally aerated stagnant 0.5 M H(2)SO(4)[J]. Corrosion Science,2010,52(3):780-787.
APA Y. H. Lu,W. Wang,H. B. Xu,X. F. Kong,&J. Wang.(2010).Copper corrosion and anodic electrodissolution mechanisms in naturally aerated stagnant 0.5 M H(2)SO(4).Corrosion Science,52(3),780-787.
MLA Y. H. Lu,et al."Copper corrosion and anodic electrodissolution mechanisms in naturally aerated stagnant 0.5 M H(2)SO(4)".Corrosion Science 52.3(2010):780-787.

入库方式: OAI收割

来源:金属研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。