First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010)
文献类型：期刊论文
| 作者 | X. Y. Pang ; Z. Q. Liu ; S. Q. Wang ; J. K. Shang |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2010 |
| 卷号 | 26期号:12页码:1057-1062 |
| 关键词 | First-principles calculation Segregation Bismuth Interface SnBi solder reactive interface cu3sn cu growth principles fracture crystal bismuth joints copper |
| ISSN号 | 1005-0302 |
| 中文摘要 | Density functional theory was employed to investigate the bismuth segregation at Cu/Cu(3)Sn(010) interface. Five initial constructions were introduced by adopting the adhesion energy criterion. Among them, the so-called "between-Cu" construction in which the interface Cu atoms of Cu slab locate along Cu-Cu bond direction in Cu(3)Sn slab was found to be the most energy-favored at an adhesion energy of 1.96 J/m(2). Based on this construction, five possible segregation sites were examined, and the most likely segregation site was determined with adhesion energy as low as 1.06 J/m(2), which was almost half of the initial one. Comparing with other sites' adhesion energies, it was concluded that size effect took a large part in embrittlement. The analyses of atomic structure and electronic density revealed that the slabs shifted away from interfaces due to bismuth segregation, and the atoms around Bi atom were pressed away. This calculated work agreed qualitatively with reported experimental results. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31406]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. Y. Pang,Z. Q. Liu,S. Q. Wang,et al. First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010)[J]. Journal of Materials Science & Technology,2010,26(12):1057-1062. |
| APA | X. Y. Pang,Z. Q. Liu,S. Q. Wang,&J. K. Shang.(2010).First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010).Journal of Materials Science & Technology,26(12),1057-1062. |
| MLA | X. Y. Pang,et al."First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010)".Journal of Materials Science & Technology 26.12(2010):1057-1062. |
入库方式： OAI收割
来源：金属研究所
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