Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques
文献类型：期刊论文
| 作者 | J. Ran ; J. Z. Zhang ; W. Q. Yao ; Y. T. Wei |
| 刊名 | Applied Surface Science
 |
| 出版日期 | 2010 |
| 卷号 | 256期号:23页码:7010-7017 |
| 关键词 | Metal film Polyimide Ion implantation Ion beam assisted deposition Adhesion assisted deposition adhesion properties copper-films thin-film implantation limitations substrate polymers |
| ISSN号 | 0169-4332 |
| 中文摘要 | Cu film and Ti/Cu film on polyimide substrate were prepared by ion implantation and ion beam assisted deposition (IBAD) techniques. Three-dimension white-light interfering profilometer was used to measure thickness of each film. The thickness of the Cu film and Ti/Cu film ranged between 490 nm and 640 nm. The depth profile, surface morphology, roughness, adhesion, nanohardness, and modulus of the Cu and Ti/Cu films were measured by scanning Auger nanoprobe (SAN), atomic force microscopy (AFM), and nanoindenter, respectively. The polyimide substrates irradiated with argon ions were analyzed by scanning electron microscopy (SEM) and AFM. The results suggested that both the Cu film and Ti/Cu film were of good adhesion with polyimide substrate, and ion beam techniques were suitable to prepare thin metal film on polyimide. (C) 2010 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31419]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | J. Ran,J. Z. Zhang,W. Q. Yao,et al. Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques[J]. Applied Surface Science,2010,256(23):7010-7017. |
| APA | J. Ran,J. Z. Zhang,W. Q. Yao,&Y. T. Wei.(2010).Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques.Applied Surface Science,256(23),7010-7017. |
| MLA | J. Ran,et al."Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques".Applied Surface Science 256.23(2010):7010-7017. |
入库方式： OAI收割
来源：金属研究所
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