Crack propagation of single crystal beta-Sn during in situ TEM straining
文献类型：期刊论文
| 作者 | P. J. Shang ; Z. Q. Liu ; D. X. Li ; J. K. Shang |
| 刊名 | Journal of Electron Microscopy
 |
| 出版日期 | 2010 |
| 卷号 | 59页码:S61-S66 |
| 关键词 | in situ TEM straining single crystal Sn slip system self-diffusion crack propagation free solder alloys lead-free solders thermal fatigue behavior creep tin pb joints ag deformation |
| ISSN号 | 0022-0744 |
| 中文摘要 | In situ tensile process of single-crystal Sn was investigated by transmission electron microscopy (TEM). Despite the traditional wedge microcrack, a new tetragonal microcrack was observed during crack propagation in the single-crystal Sn. During in situ tensile straining, the dislocation dipoles formed at the front of the wedge microcrack tip, the coalescence of which is the source of microvoids at the crack tip, and then the wedge microcrack propagated deeply by aggregation of discontinuous microvoids. The tetragonal microcrack propagated by the intersection along two vertical slip planes. Moreover, the series of high-resolution images showed that Sn islands formed at the center of the frontier crack plane due to the anisotropic self-diffusion of Sn atoms along different crystallographic planes. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/31426]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | P. J. Shang,Z. Q. Liu,D. X. Li,et al. Crack propagation of single crystal beta-Sn during in situ TEM straining[J]. Journal of Electron Microscopy,2010,59:S61-S66. |
| APA | P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2010).Crack propagation of single crystal beta-Sn during in situ TEM straining.Journal of Electron Microscopy,59,S61-S66. |
| MLA | P. J. Shang,et al."Crack propagation of single crystal beta-Sn during in situ TEM straining".Journal of Electron Microscopy 59(2010):S61-S66. |
入库方式： OAI收割
来源：金属研究所
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