Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints
文献类型：期刊论文
| 作者 | X. J. Wang ; Q. L. Zeng ; Q. S. Zhu ; Z. G. Wang ; J. K. Shang |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2010 |
| 卷号 | 26期号:8页码:737-742 |
| ISSN号 | 1005-0302 |
| 关键词 | Strength Fracture strain Voids Solder al interconnects electromigration growth lines sn |
| 中文摘要 | Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples of eutectic Sn-3.8Ag-0.7Cu (SAC) joined by Cu plates at two sides. The electromigratipn tests were conducted at a current density of about 1.1x10(3) A/cm(2) and a working temperature of about 83 degrees C. The results showed that the shear strength and flow stress decreased greatly after current stressing. Such a decrease was associated with no significant loss of the fracture strain at short electromigration but a great reduction in the fracture strain after long-term current stressing. The variation of the fracture strain with the electromigration time was shown to result from the shift of the fracture surface from the center of the solder towards the intermetallic compound (IMC) interface at the cathode. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31526]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. J. Wang,Q. L. Zeng,Q. S. Zhu,et al. Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints[J]. Journal of Materials Science & Technology,2010,26(8):737-742. |
| APA | X. J. Wang,Q. L. Zeng,Q. S. Zhu,Z. G. Wang,&J. K. Shang.(2010).Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints.Journal of Materials Science & Technology,26(8),737-742. |
| MLA | X. J. Wang,et al."Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints".Journal of Materials Science & Technology 26.8(2010):737-742. |
入库方式： OAI收割
来源：金属研究所
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