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Interfacial diffusion in Cu with a gradient nanostructured surface layer
文献类型：期刊论文
| 作者 | Z. B. Wang ; K. Lu ; G. Wilde ; S. V. Divinski |
| 刊名 | Acta Materialia
 |
| 出版日期 | 2010 |
| 卷号 | 58期号:7页码:2376-2386 |
| 关键词 | Nanostructured material Surface mechanical attrition treatment Diffusion Grain boundaries Twin boundaries grain-boundary diffusion mechanical attrition treatment severe plastic-deformation nanocrystalline copper self-diffusion nickel alloys bulk temperatures segregation |
| ISSN号 | 1359-6454 |
| 中文摘要 | A graded microstructure was produced in the surface layer of a pure Cu sample by means of surface mechanical attrition treatment (SMAT) [Wang K, Tao NR, Liu G, Lu J, Lu K. Acta Mater 2006;54:5281.]. The diffusion behavior of (63)Ni in such a surface layer was investigated by the radiotracer technique at temperatures <438 K. It is shown that the effective diffusivity in the top 10 mu m surface layer is more than 2 orders of magnitude higher than that along conventional high-angle grain boundaries (HAGB) in Cu of similar purity. The diffusion rate increases gradually with increasing depth up to 30-50 mu m, and then decreases with further increasing depth. The enhanced diffusivities reveal higher-energy states of various interfaces in the SMAT surface layer. The excess free energy of HAGB in this layer is estimated to be similar to 30% higher than that of conventional grain boundaries. An apparent retardation of the effective diffusion rate in the top 25 mu m surface layer is induced by tracer leakage into numerous twin-boundary-like interfaces, while the gradual decrease in interface excess free energy correlates with the observed decrease in diffusivity in the subsurface layer at depths exceeding 50 mu m. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31554]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Z. B. Wang,K. Lu,G. Wilde,et al. Interfacial diffusion in Cu with a gradient nanostructured surface layer[J]. Acta Materialia,2010,58(7):2376-2386. |
| APA | Z. B. Wang,K. Lu,G. Wilde,&S. V. Divinski.(2010).Interfacial diffusion in Cu with a gradient nanostructured surface layer.Acta Materialia,58(7),2376-2386. |
| MLA | Z. B. Wang,et al."Interfacial diffusion in Cu with a gradient nanostructured surface layer".Acta Materialia 58.7(2010):2376-2386. |
入库方式： OAI收割
来源：金属研究所
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