On the length scale of cyclic strain localization in fine-grained copper films
文献类型：期刊论文
| 作者 | B. Zhang ; K. H. Sun ; Y. Liu ; G. P. Zhang |
| 刊名 | Philosophical Magazine Letters
 |
| 出版日期 | 2010 |
| 卷号 | 90期号:1页码:69-76 |
| 关键词 | cyclic strain localization length scale fine grain metal film fatigue mechanisms damage behavior metals |
| ISSN号 | 0950-0839 |
| 中文摘要 | Fine-grained copper films on a flexible substrate were cyclically deformed under constant strain range control. It was found that cyclic dislocation plasticity through individual dislocation glide is still dominant at the submicrometer scale, while the ability of irreversible slip of dislocations gradually decreases and the damage was changed from extrusion-induced localization to cracking along grain boundary. Statistical evaluation of the mean spacing between slip bands and/or lines leads to a critical scale (similar to 28 nm) below which dislocation-controlled cyclic strain localization would be shut down. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31679]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | B. Zhang,K. H. Sun,Y. Liu,et al. On the length scale of cyclic strain localization in fine-grained copper films[J]. Philosophical Magazine Letters,2010,90(1):69-76. |
| APA | B. Zhang,K. H. Sun,Y. Liu,&G. P. Zhang.(2010).On the length scale of cyclic strain localization in fine-grained copper films.Philosophical Magazine Letters,90(1),69-76. |
| MLA | B. Zhang,et al."On the length scale of cyclic strain localization in fine-grained copper films".Philosophical Magazine Letters 90.1(2010):69-76. |
入库方式： OAI收割
来源：金属研究所
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