Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate
文献类型：期刊论文
| 作者 | Q. K. Zhang ; H. F. Zou ; Z. F. Zhang |
| 刊名 | Journal of Materials Research
 |
| 出版日期 | 2010 |
| 卷号 | 25期号:2页码:303-314 |
| 关键词 | interfacial embrittlement mechanical-properties grain-boundaries sn-3.5ag solders bismuth solder copper segregation metallization interconnect strength |
| ISSN号 | 0884-2914 |
| 中文摘要 | To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu-X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu-X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu-X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu-X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn-Bi solder widely used in the electronic interconnection in the future. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31721]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. K. Zhang,H. F. Zou,Z. F. Zhang. Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate[J]. Journal of Materials Research,2010,25(2):303-314. |
| APA | Q. K. Zhang,H. F. Zou,&Z. F. Zhang.(2010).Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate.Journal of Materials Research,25(2),303-314. |
| MLA | Q. K. Zhang,et al."Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate".Journal of Materials Research 25.2(2010):303-314. |
入库方式： OAI收割
来源：金属研究所
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