Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate
文献类型：期刊论文
| 作者 | X. F. Zhang ; J. D. Guo ; J. K. Shang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2010 |
| 卷号 | 39期号:3页码:333-337 |
| 关键词 | Polarity effect current stressing effective charge FeNi interfacial reactions thin-films alloy segregation diffusion kinetics |
| ISSN号 | 0361-5235 |
| 中文摘要 | The effect of polarity on interfacial reactions under high-density electric current was investigated in Cu/FeNi/Sn/FeNi/Cu solder interconnects. A reverse polarity effect was found where the FeSn(2) intermetallic compound (IMC) layer at the cathode grew significantly thicker than that at the anode under electric loading. Such an abnormal polarity effect was shown to result from electromigration of Fe in the direction opposite to the electron flow. At the same time, a Cu-rich layer developed next to the FeSn(2) layer at the anode side. Kinetic analysis of Fe and Cu mass transport explained the differential growth of the IMCs at the two electrodes, in good agreement with the experimental data. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31726]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate[J]. Journal of Electronic Materials,2010,39(3):333-337. |
| APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2010).Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate.Journal of Electronic Materials,39(3),333-337. |
| MLA | X. F. Zhang,et al."Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate".Journal of Electronic Materials 39.3(2010):333-337. |
入库方式： OAI收割
来源：金属研究所
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