TiN/TiC multilayer films deposited by pulse biased arc ion plating
文献类型:期刊论文
作者 | Y. H. Zhao ; G. Q. Lin ; J. Q. Xiao ; C. A. Dong ; L. S. Wen |
刊名 | Vacuum |
出版日期 | 2010 |
卷号 | 85期号:1页码:40912 |
ISSN号 | 0042-207X |
关键词 | TIN/TIC multilayer films Pulse biased arc ion plating Microhardness Film/substrate adhesion mechanical-properties hard coatings behavior systems design steel |
中文摘要 | TiN/TiC multilayer films were deposited on high-speed-steel (HSS) substrates using pulse biased arc ion plating. For comparison, TiN and TIC films were also deposited. Scanning electron microscopy (SEM), X-ray diffraction (XRD) and Auger electron spectroscopy (AES) were applied to investigate the modulation period thickness, microstructure and content depth distribution of the films, respectively. And microhardness and film/substrate adhesion were also analyzed using knoop tester and scratching method. The results showed that the multilayer films with different modulation period of 40-240 nm exhibit a modulation structure and the interface width is about 20 similar to 30 nm. Microhardness of the multilayer films were not obviously improved compared to that of TiN and TIC film, and the reason was analyzed. In comparison to TIN film, film/substrate adhesion values of the multilayer films were deteriorated with the increasing of modulation period due to the brittle characteristics of TIC film. (C) 2009 Published by Elsevier Ltd. |
原文出处 | |
公开日期 | 2012-04-13 |
源URL | [http://210.72.142.130/handle/321006/31752] |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | Y. H. Zhao,G. Q. Lin,J. Q. Xiao,et al. TiN/TiC multilayer films deposited by pulse biased arc ion plating[J]. Vacuum,2010,85(1):40912. |
APA | Y. H. Zhao,G. Q. Lin,J. Q. Xiao,C. A. Dong,&L. S. Wen.(2010).TiN/TiC multilayer films deposited by pulse biased arc ion plating.Vacuum,85(1),40912. |
MLA | Y. H. Zhao,et al."TiN/TiC multilayer films deposited by pulse biased arc ion plating".Vacuum 85.1(2010):40912. |
入库方式: OAI收割
来源:金属研究所
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