Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM
文献类型：期刊论文
| 作者 | Q. S. Zhu ; J. J. Guo ; P. J. Shang ; Z. G. Wang ; J. K. Shang |
| 刊名 | Advanced Engineering Materials
 |
| 出版日期 | 2010 |
| 卷号 | 12期号:6页码:497-503 |
| 关键词 | p alloy film sn-ag solder phosphorus concentration joints strength chip metallization interconnect segregation technology |
| ISSN号 | 1438-1656 |
| 中文摘要 | Effects of thermal aging on the interfacial microstructure and reliability of the SnAgCu/FeNi-Cu joint are investigated. It is found that aging effects depends strongly on the temperature. Aging at low temperature, e.g., at 125 degrees C, a submicron meter thick FeSn(2) IMC layer formed at the SnAgCu/FeNi-Cu interface during reflowing grows at a rate twenty times slower than the growth rate of the IMC at the SnAgCu/Cu interface. At high temperature, e.g., at 180 degrees C, the Cu element is found to diffuse through FeNi layer to produce the (Cu, Ni)(6)Sn(5) IMC and this IMC layer grows even faster than the IMC at the SnAgCu/Cu interface. Solder ball shear test results show that the SnAgCu/FeNi-Cu joint has a comparable strength to the SnAgCu/Cu joint after reflowing, and the strength drop after aging at 125 degrees C is less than that of the SnAgCu/Cu joint. However, after aging at 180 degrees C, the strength of the SnAgCu/FeNi-Cu joint is degraded to a low value, along with a shift in failure mode from the solder fracture to the brittle intermetallics fracture. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31790]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. S. Zhu,J. J. Guo,P. J. Shang,et al. Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM[J]. Advanced Engineering Materials,2010,12(6):497-503. |
| APA | Q. S. Zhu,J. J. Guo,P. J. Shang,Z. G. Wang,&J. K. Shang.(2010).Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM.Advanced Engineering Materials,12(6),497-503. |
| MLA | Q. S. Zhu,et al."Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM".Advanced Engineering Materials 12.6(2010):497-503. |
入库方式： OAI收割
来源：金属研究所
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