Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints
文献类型：期刊论文
| 作者 | H. F. Zou ; Z. F. Zhang |
| 刊名 | Microelectronic Engineering
 |
| 出版日期 | 2010 |
| 卷号 | 87期号:4页码:601-609 |
| 关键词 | Sn-Cu solder Interfacial strength Intermetallic compounds Ductile-to-brittle transition Strain rate Fracture lead-free solders intermetallic compounds tensile properties microstructure growth alloy |
| ISSN号 | 0167-9317 |
| 中文摘要 | The effects of aging time, strain rate and solder thickness on fracture behaviors of Sn-3Cu/Cu single crystal joints were investigated. Experimental results showed that short aging time (less than 10 days) did not obviously affect the tensile strength and fracture behaviors of the solder joints. However, strain rate and solder thickness played significant roles in the strength and fracture behaviors of the solder joints. It was observed that these joints broke in a ductile manner at low strain rates with a rapid increase in the tensile strength, but displayed a brittle manner at high strain rates with a slow increase in the tensile strength. A model was proposed to explain such ductile-to-brittle transition between solder and intermetallic compounds. In addition, the solder joints broke in a ductile manner and presented a low tensile strength for the joints with thicker solder, but displayed a brittle manner and a higher tensile strength for the joints with thinner solder. (C) 2009 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31807]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. F. Zou,Z. F. Zhang. Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints[J]. Microelectronic Engineering,2010,87(4):601-609. |
| APA | H. F. Zou,&Z. F. Zhang.(2010).Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints.Microelectronic Engineering,87(4),601-609. |
| MLA | H. F. Zou,et al."Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints".Microelectronic Engineering 87.4(2010):601-609. |
入库方式： OAI收割
来源：金属研究所
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