中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints

文献类型:期刊论文

作者H. F. Zou ; Z. F. Zhang
刊名Microelectronic Engineering
出版日期2010
卷号87期号:4页码:601-609
关键词Sn-Cu solder Interfacial strength Intermetallic compounds Ductile-to-brittle transition Strain rate Fracture lead-free solders intermetallic compounds tensile properties microstructure growth alloy
ISSN号0167-9317
中文摘要The effects of aging time, strain rate and solder thickness on fracture behaviors of Sn-3Cu/Cu single crystal joints were investigated. Experimental results showed that short aging time (less than 10 days) did not obviously affect the tensile strength and fracture behaviors of the solder joints. However, strain rate and solder thickness played significant roles in the strength and fracture behaviors of the solder joints. It was observed that these joints broke in a ductile manner at low strain rates with a rapid increase in the tensile strength, but displayed a brittle manner at high strain rates with a slow increase in the tensile strength. A model was proposed to explain such ductile-to-brittle transition between solder and intermetallic compounds. In addition, the solder joints broke in a ductile manner and presented a low tensile strength for the joints with thicker solder, but displayed a brittle manner and a higher tensile strength for the joints with thinner solder. (C) 2009 Elsevier B.V. All rights reserved.
原文出处://WOS:000275264200015
公开日期2012-04-13
源URL[http://210.72.142.130/handle/321006/31807]  
专题金属研究所_中国科学院金属研究所
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GB/T 7714
H. F. Zou,Z. F. Zhang. Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints[J]. Microelectronic Engineering,2010,87(4):601-609.
APA H. F. Zou,&Z. F. Zhang.(2010).Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints.Microelectronic Engineering,87(4),601-609.
MLA H. F. Zou,et al."Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints".Microelectronic Engineering 87.4(2010):601-609.

入库方式: OAI收割

来源:金属研究所

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