Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings
文献类型：期刊论文
| 作者 | J. P. Daghfal ; P. J. Shang ; Z. Q. Liu ; J. K. Shang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2009 |
| 卷号 | 38期号:12页码:2506-2515 |
| 关键词 | In-Sn solder Ni-Fe metallization interface FeSn(2) Ni(3)Sn(4) faceting in-48sn solder in-49sn solder reflow process microstructure substrate packages kinetics alloy joint ag |
| ISSN号 | 0361-5235 |
| 中文摘要 | Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni(3)Sn(4) and FeSn(2) phases appeared at the interface along with Cu(6)Sn(5) in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni(3)Sn(4) crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31862]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | J. P. Daghfal,P. J. Shang,Z. Q. Liu,et al. Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings[J]. Journal of Electronic Materials,2009,38(12):2506-2515. |
| APA | J. P. Daghfal,P. J. Shang,Z. Q. Liu,&J. K. Shang.(2009).Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings.Journal of Electronic Materials,38(12),2506-2515. |
| MLA | J. P. Daghfal,et al."Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings".Journal of Electronic Materials 38.12(2009):2506-2515. |
入库方式： OAI收割
来源：金属研究所
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