Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints
文献类型：期刊论文
| 作者 | X. N. Du ; J. D. Guo ; J. K. Shang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2009 |
| 卷号 | 38期号:11页码:2398-2404 |
| 关键词 | Electromigration solder joint intermetallic compound lead-free solders alloy interconnects technology bump |
| ISSN号 | 0361-5235 |
| 中文摘要 | The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu(3)Sn and Cu(6)Sn(5) intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140A degrees C, the thickness of the Cu(6)Sn(5) IMC at the anode increased significantly. Sn(3)Sb(2) IMC coarsened in the Cu(6)Sn(5) IMC at the anode and in the beta-Sn at the cathode. The possible mechanism of the electromigration effect is discussed. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31881]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. N. Du,J. D. Guo,J. K. Shang. Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints[J]. Journal of Electronic Materials,2009,38(11):2398-2404. |
| APA | X. N. Du,J. D. Guo,&J. K. Shang.(2009).Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints.Journal of Electronic Materials,38(11),2398-2404. |
| MLA | X. N. Du,et al."Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints".Journal of Electronic Materials 38.11(2009):2398-2404. |
入库方式： OAI收割
来源：金属研究所
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