Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces
文献类型：期刊论文
| 作者 | H. Y. Guo ; J. D. Guo ; J. K. Shang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2009 |
| 卷号 | 38期号:12页码:2470-2478 |
| 关键词 | Solder thermal interface materials thermal cycling thermal resistance crack propagation joints fatigue shear |
| ISSN号 | 0361-5235 |
| 中文摘要 | The thermal resistance of Si/Sn-52In/Cu sandwiched samples was measured by the laser flash method after various stages of thermal cycling. The thermal resistance was found to increase with increasing thermal cycles after 120 cycles. Cross-sections of the samples were examined by scanning electron microscopy. Cracks were observed in both the solder bulk and the interface between the intermetallic compound and solder. The increase of the thermal resistance was related to widening of the crack segments that were inclined to the interface. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/31935]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. Y. Guo,J. D. Guo,J. K. Shang. Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces[J]. Journal of Electronic Materials,2009,38(12):2470-2478. |
| APA | H. Y. Guo,J. D. Guo,&J. K. Shang.(2009).Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces.Journal of Electronic Materials,38(12),2470-2478. |
| MLA | H. Y. Guo,et al."Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces".Journal of Electronic Materials 38.12(2009):2470-2478. |
入库方式： OAI收割
来源：金属研究所
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