An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy
文献类型：期刊论文
| 作者 | M. Sang ; K. Du ; H. Q. Ye |
| 刊名 | Journal of Alloys and Compounds
 |
| 出版日期 | 2009 |
| 卷号 | 469期号:1-2页码:129-136 |
| 关键词 | Intermetallics Crystal structure Cu(3)Sn Transmission electron microscopy pb-free solders interfacial reactions high-resolution tin-lead intermetallics copper contrast nanoindentation interconnects kinetics |
| ISSN号 | 0925-8388 |
| 中文摘要 | Cu(3)Sn phase with the D0(19) structure is observed in Cu-Sn alloy by transmission electron microscopy, The structure is determined by electron diffraction, high-resolution transmission electron microscopy and high-angle annular dark-field imaging techniques. To the best of our knowledge this structure has not been reported before in Cu(3)Sn compounds. Transmission electron microscopy revealed high-density antiphase boundaries lying on the (0 (1) over bar 10) planes with translation vectors of (a/2)((2) over bar 110) in the D0(19) Cu(3)Sn. (C) 2008 Elsevier B.V. All rights reserved |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32258]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | M. Sang,K. Du,H. Q. Ye. An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy[J]. Journal of Alloys and Compounds,2009,469(1-2):129-136. |
| APA | M. Sang,K. Du,&H. Q. Ye.(2009).An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy.Journal of Alloys and Compounds,469(1-2),129-136. |
| MLA | M. Sang,et al."An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy".Journal of Alloys and Compounds 469.1-2(2009):129-136. |
入库方式： OAI收割
来源：金属研究所
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