Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates
文献类型：期刊论文
| 作者 | P. J. Shang ; Z. Q. Liu ; X. Y. Pang ; D. X. Li ; J. K. Shang |
| 刊名 | Acta Materialia
 |
| 出版日期 | 2009 |
| 卷号 | 57期号:16页码:4697-4706 |
| 关键词 | Cu(3)Sn Growth mechanism Interface Soldering Transmission electron microscopy solder joints interfacial reactions intermetallic growth reactive interface diffusion couples molten sn temperature technology copper layers |
| ISSN号 | 1359-6454 |
| 中文摘要 | A comprehensive transmission electron microscopy (TEM) study was conducted to investigate the growth mechanisms Of Cu(3)Sn on polycrystalline and single crystalline Cu substrates in solder joints. On single crystalline Cu the solder reflow process resulted in the growth of columnar Cu(3)Sn grains aligned in a thin uniform layer perpendicular to the interface, while a thick Cu(3)Sn layer formed from fine equiaxed grains on the polycrystalline substrate. In the subsequent solid state aging, columnar growth Of Cu(3)Sn continued on the single crystalline Cu before it was replaced by nucleation and growth of new triangular Cu(3)Sn grains at the triple junction sites of the Cu/Cu(3)Sn interface. On the polycrystalline Cu the solid state aging caused much more rapid growth of the Cu(3)Sn layer due to nucleation and the growth of new Cu(3)Sn grains at both the Cu/Cu(3)Sn and Cu(6)Sn(5)/Cu(3)Sn interfaces. These different growth behaviors Of Cu(3)Sn were related to the diffusive supply of reactive elements. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32262]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | P. J. Shang,Z. Q. Liu,X. Y. Pang,et al. Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates[J]. Acta Materialia,2009,57(16):4697-4706. |
| APA | P. J. Shang,Z. Q. Liu,X. Y. Pang,D. X. Li,&J. K. Shang.(2009).Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates.Acta Materialia,57(16),4697-4706. |
| MLA | P. J. Shang,et al."Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates".Acta Materialia 57.16(2009):4697-4706. |
入库方式： OAI收割
来源：金属研究所
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