An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys
文献类型：期刊论文
| 作者 | H. Q. Sun ; Y. N. Shi |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2009 |
| 卷号 | 25期号:3页码:347-350 |
| 关键词 | Nanomaterials Mechanical properties Hardness strain-rate sensitivity tomographic atom-probe plastic-deformation mechanical-behavior thermal-stability metals copper strength fracture microstructure |
| ISSN号 | 1005-0302 |
| 中文摘要 | Nanocrystalline Cu-Ni-P alloys with average grain sizes of 7, 10 and 24 nm were synthesized by means of electrodeposition. The grain size dependences of tensile strength and hardness of the nanocrystalline Cu alloys were investigated. The breakdown of Hall-Petch relation was exhibited in both tensile strength and hardness. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32304]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. Q. Sun,Y. N. Shi. An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys[J]. Journal of Materials Science & Technology,2009,25(3):347-350. |
| APA | H. Q. Sun,&Y. N. Shi.(2009).An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys.Journal of Materials Science & Technology,25(3),347-350. |
| MLA | H. Q. Sun,et al."An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys".Journal of Materials Science & Technology 25.3(2009):347-350. |
入库方式： OAI收割
来源：金属研究所
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