Electroless Ni-P coating on W-Cu alloy via potential activation process
文献类型：期刊论文
| 作者 | L. L. Wang ; H. J. Chen ; W. Q. Huang ; L. Hao |
| 刊名 | Surface Engineering
 |
| 出版日期 | 2009 |
| 卷号 | 25期号:5页码:376-381 |
| 关键词 | Electroless deposition Ni-P coating W-Cu alloy Adhesion Microhardness Corrosion resistance sintering behavior nickel composite powders |
| ISSN号 | 0267-0844 |
| 中文摘要 | Electroless Ni-P coating was deposited on W-Cu alloy via potential activation at -0.8 V. The coating was characterised for its morphology, structure, microhardness and the corrosion resistance. Scanning electron microscopy observation showed the presence of smooth and compact crystals in the coating. X-ray diffraction analysis showed that the Ni-P coating was amorphous in structure. The adhesion between Ni-P coating and W-Cu alloy was qualified. Heat treatment can improve the microhardness of Ni-P coating. Both the porosity test and immersion test in 10 vol.-% H(2)SO(4) solution revealed that the Ni-P coating exhibited good corrosion resistance properties in protecting the W-Cu alloy. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/32361]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | L. L. Wang,H. J. Chen,W. Q. Huang,et al. Electroless Ni-P coating on W-Cu alloy via potential activation process[J]. Surface Engineering,2009,25(5):376-381. |
| APA | L. L. Wang,H. J. Chen,W. Q. Huang,&L. Hao.(2009).Electroless Ni-P coating on W-Cu alloy via potential activation process.Surface Engineering,25(5),376-381. |
| MLA | L. L. Wang,et al."Electroless Ni-P coating on W-Cu alloy via potential activation process".Surface Engineering 25.5(2009):376-381. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。