Observations of continuous tin whisker growth in NdSn(3) intermetallic compound
文献类型：期刊论文
| 作者 | A. P. Xian ; M. Liu |
| 刊名 | Journal of Materials Research
 |
| 出版日期 | 2009 |
| 卷号 | 24期号:9页码:2775-2783 |
| 关键词 | sn mechanism finishes surface alloys cu |
| ISSN号 | 0884-2914 |
| 中文摘要 | In situ observation of tin whisker growth in NdSn(3) compound was carried out by using an optical microscope (OM) and scanning electron microscopy (SEM). The growth rate of Sn-whisker from NdSn(3) is shown to be rapid (approximately 8-15 A/s) during exposure to room ambience, and it is accompanied by formation of a new compound, Nd(OH)(3), as was confirmed by x-ray diffraction. This reaction between the Sn-RE compound and trace water in room ambience has significant influence on whisker growth. There is an electron irradiation effect on whisker growth; that is, whiskers stopped growing after being observed in SEM. Therefore, it is suggested that OM be used rather than SEM to observe the continuous whisker growth. In discussion, the driving force per Sn atom for whisker growth is estimated as 1 x 10(14) N in accordance with the whisker growth rate, and its apparent force originates from a chemical potential gradient between the released Sri atoms and the whisker. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32441]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | A. P. Xian,M. Liu. Observations of continuous tin whisker growth in NdSn(3) intermetallic compound[J]. Journal of Materials Research,2009,24(9):2775-2783. |
| APA | A. P. Xian,&M. Liu.(2009).Observations of continuous tin whisker growth in NdSn(3) intermetallic compound.Journal of Materials Research,24(9),2775-2783. |
| MLA | A. P. Xian,et al."Observations of continuous tin whisker growth in NdSn(3) intermetallic compound".Journal of Materials Research 24.9(2009):2775-2783. |
入库方式： OAI收割
来源：金属研究所
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