Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects
文献类型：期刊论文
| 作者 | J. Zhang ; J. Y. Zhang ; G. Liu ; Y. Zhao ; X. D. Ding ; G. P. Zhang ; J. Sun |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2009 |
| 卷号 | 60期号:4页码:228-231 |
| 关键词 | Thermal fatigue Thin films copper-films electromigration lifetime damage |
| ISSN号 | 1359-6462 |
| 中文摘要 | Thermal fatigue of Cu interconnects 60 nm thick and 5-15 mu m wide was investigated by using alternating current to generate cycling temperature and strain/stress. The fatigue curves exhibit two regions, i.e. high- and low-cycle regions, which correspond to low and high thermal strains, respectively. The high-cycle region is found to be controlled by all unusual thermal Fatigue mechanism of damage hands, which is related to a unique structure comprising only a single layer of grains distributed along the thickness. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32549]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | J. Zhang,J. Y. Zhang,G. Liu,et al. Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects[J]. Scripta Materialia,2009,60(4):228-231. |
| APA | J. Zhang.,J. Y. Zhang.,G. Liu.,Y. Zhao.,X. D. Ding.,...&J. Sun.(2009).Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects.Scripta Materialia,60(4),228-231. |
| MLA | J. Zhang,et al."Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects".Scripta Materialia 60.4(2009):228-231. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。