Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times
文献类型：期刊论文
| 作者 | Q. K. Zhang ; Z. F. Zhang |
| 刊名 | Journal of Alloys and Compounds
 |
| 出版日期 | 2009 |
| 卷号 | 485期号:1-2页码:853-861 |
| 关键词 | Sn-4Ag solder Interfacial IMCs Tensile properties Strain rate Fracture mechanism lead-free solders sn-ag shear-strength tensile properties intermetallic compound deformation-behavior strain-rate interfacial reaction cu substrate microstructure |
| ISSN号 | 0925-8388 |
| 中文摘要 | Tensile properties and fracture mechanisms of Cu/Sn-4Ag solder joints aged at 180 degrees C for different times were investigated at the strain rates of 1.25 x 10(-4) s(-1) and 1.25 x 10(-1) s(-1) At the low strain rate, it was found that the tensile strength of the solder joints decreased with increasing aging time in principle. though the tendency was not monotonously at the early stage of aging, and all the solder joints had similar tensile curves but different fracture morphologies and fracture processes. At the high strain rate, tensile strength of the solder joints was much higher and decreased monotonously with increasing aging time, with identical fracture process and fractographies. Evolution of the Cu/Sn-4Ag interfacial morphology during aging process and the effect of aging on tensile property of the Sn-4Ag alloy were also involved for further analysis. Based on the experimental results and observations, the fracture processes were revealed and some factors controlling the tensile strength of solder joints were discussed qualitatively (C) 2009 Elsevier B.V. All rights reserved |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32561]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. K. Zhang,Z. F. Zhang. Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times[J]. Journal of Alloys and Compounds,2009,485(1-2):853-861. |
| APA | Q. K. Zhang,&Z. F. Zhang.(2009).Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times.Journal of Alloys and Compounds,485(1-2),853-861. |
| MLA | Q. K. Zhang,et al."Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times".Journal of Alloys and Compounds 485.1-2(2009):853-861. |
入库方式： OAI收割
来源：金属研究所
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