Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints
文献类型：期刊论文
| 作者 | Q. K. Zhang ; H. F. Zou ; Z. F. Zhang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2009 |
| 卷号 | 38期号:6页码:852-859 |
| 关键词 | Lead-free solders interface intermetallic compounds (IMCs) fatigue crack fractography intermetallic compound deformation-behavior cu microstructure evolution growth 96.5sn-3.5ag temperature interfaces morphology |
| ISSN号 | 0361-5235 |
| 中文摘要 | Tensile properties and stress-controlled fatigue fracture behaviors of Cu/Sn-4Ag solder joints aged at 180A degrees C for different times were systematically investigated. It was found that the tensile strength of the solder joints decreased with increasing aging time and that the fracture mode changed from ductile to brittle. The fatigue life of the solder joints also decreased with increasing aging time. For most of the solder joints, fatigue cracks tended to initiate around the Cu/Cu(6)Sn(5) interfaces due to the strain incompatibility and local strain concentration on a micro-scale, and they then propagated within the solder proximately along the Cu/Cu(6)Sn(5) interfaces. The samples aged fora different pound times or tested under different stress amplitudes had similar fractography morphologies, which consisted mainly of a propagation region, covered by solder, and a final fracture region. Based on the experimental observations above, the corresponding interfacial fatigue failure mechanisms were discussed in terms of different influencing factors. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32562]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. K. Zhang,H. F. Zou,Z. F. Zhang. Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints[J]. Journal of Electronic Materials,2009,38(6):852-859. |
| APA | Q. K. Zhang,H. F. Zou,&Z. F. Zhang.(2009).Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints.Journal of Electronic Materials,38(6),852-859. |
| MLA | Q. K. Zhang,et al."Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints".Journal of Electronic Materials 38.6(2009):852-859. |
入库方式： OAI收割
来源：金属研究所
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