Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization
文献类型:期刊论文
作者 | X. F. Zhang ; J. D. Guo ; J. K. Shang |
刊名 | Journal of Alloys and Compounds
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出版日期 | 2009 |
卷号 | 487期号:1-2页码:776-780 |
关键词 | Intermetallics Kinetics Interfacial reactions FeNi Activation energy zn based solders ni-p/au layer interfacial reactions sn-ag cu electromigration interconnect microstructure substrate alloys |
ISSN号 | 0925-8388 |
中文摘要 | Interfacial reactions and growth kinetics of intermetallic compound layers formed between Sn-9Zn solder and electroplated Fe-42Ni metallization were investigated after ageing at 120,150 and 170 degrees C for up to 360 h. Experimental results show that the intermetallic compound formed at the interface was mainly delta-FeZn(8.87) phase, rather than the FeSn(2) phase. The reason is that the attraction between Zn and Fe is stronger than that of Sn and Fe. The growth exponent n for delta-FeZn(8.87) phase was found to be about 0.5, indicating that it grew by a diffusion-controlled process. The activation energy for the growth of delta-FeZn(8.87) phase was determined to be 42 kJ/mol, which is in good agreement with the reported data. Crown Copyright (C) 2009 Published by Elsevier B.V. All rights reserved. |
原文出处 | |
公开日期 | 2012-04-13 |
源URL | [http://210.72.142.130/handle/321006/32575] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization[J]. Journal of Alloys and Compounds,2009,487(1-2):776-780. |
APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2009).Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization.Journal of Alloys and Compounds,487(1-2),776-780. |
MLA | X. F. Zhang,et al."Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization".Journal of Alloys and Compounds 487.1-2(2009):776-780. |
入库方式: OAI收割
来源:金属研究所
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