Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition
文献类型：期刊论文
| 作者 | X. F. Zhang ; J. D. Guo ; J. K. Shang |
| 刊名 | Journal of Alloys and Compounds
 |
| 出版日期 | 2009 |
| 卷号 | 479期号:1-2页码:505-510 |
| 关键词 | Intermetallic compound Electroless Ni-P Interfacial reaction Zn addition Tin lead-free solders interfacial reactions cu substrate metallization joints reliability growth microstructure packages alloys |
| ISSN号 | 0925-8388 |
| 中文摘要 | Effects of Zn addition on the interfacial reaction between Sn and Ni(P) were investigated by systematically varying the Zn concentration in the Sn solder. It was found that the typical Ni-Sn reaction product, Ni(3)Sn(4) phase, was changed substantially by adding small amounts of Zn to the Sn. With the Zn addition, the ternary Ni(4)(Sn(1-x)Zn(x)) phase formed at the interface during reflow and aging according to X-ray diffraction analysis. In the Ni(4)(Sn(1-x)Zn(x)) phase, the lattice parameters contracted with increasing Zn content, in agreement with the Vegard's law. Since diffusions of the reactive species through the denser ternary intermetallic compound were more unlikely than through the binary Ni(3)Sn(4), the Zn-containing solder showed a much slower electroless Ni-P consumption rate than Sn. The decrease in Ni consumption rate increased with the increasing Zn content in Sn. The reason for the decrease was that the growth rate of Ni(4)(Sn(1-x)Zn(x)) phase was directly determined by substitution of Zn atoms into the Sn sublattice. (C) 2009 Published by Elsevier B.V. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32576]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition[J]. Journal of Alloys and Compounds,2009,479(1-2):505-510. |
| APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2009).Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition.Journal of Alloys and Compounds,479(1-2),505-510. |
| MLA | X. F. Zhang,et al."Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition".Journal of Alloys and Compounds 479.1-2(2009):505-510. |
入库方式： OAI收割
来源：金属研究所
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