Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
文献类型：期刊论文
| 作者 | X. F. Zhang ; J. D. Guo ; J. K. Shang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2009 |
| 卷号 | 38期号:3页码:425-429 |
| 关键词 | Electromigration coupling effect polarity intermetallic compound interfacial reaction zn based solders ni-p/au layer cross-interaction intermetallic compounds bump metallization eutectic snpb sn-9zn solder cu joints combination |
| ISSN号 | 0361-5235 |
| 中文摘要 | Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 x 10(4) A/cm(2) for 168.5 h at 150A degrees C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni(5)Zn(21) and Cu(5)Zn(8) were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a thicker Cu(6)Sn(5) phase replaced the Ni(5)Zn(21) phase at the Ni/Sn-Zn interface, whereas at the Cu/Sn-Zn interface, a thicker beta-CuZn phase replaced the Cu(5)Zn(8) phase. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32577]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect[J]. Journal of Electronic Materials,2009,38(3):425-429. |
| APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2009).Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect.Journal of Electronic Materials,38(3),425-429. |
| MLA | X. F. Zhang,et al."Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect".Journal of Electronic Materials 38.3(2009):425-429. |
入库方式： OAI收割
来源：金属研究所
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