A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction
文献类型：期刊论文
| 作者 | H. F. Zou ; H. J. Yang ; Z. F. Zhang |
| 刊名 | Journal of Applied Physics
 |
| 出版日期 | 2009 |
| 卷号 | 106期号:11 |
| 关键词 | ageing copper copper alloys electron backscattering electron diffraction texture tin alloys wetting lead-free solders interfacial reactions single-crystal molten sn growth joints |
| ISSN号 | 0021-8979 |
| 中文摘要 | The wetting reaction between molten Sn and (011) Cu single crystal was investigated. Based on the electron backscattered diffraction technique, the preferential orientation relationships between the scallop-type Cu(6)Sn(5) grains and (011) Cu single crystals were detected. The strong texture of Cu(6)Sn(5) grains was formed on the normal direction although the Sn/(011) Cu couple was aged at 170 degrees C for 40 days. This indicates that the Cu(6)Sn(5) grains do not desultorily form on the (011) Cu substrate for these scallop-type Cu(6)Sn(5) grains. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32642]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. F. Zou,H. J. Yang,Z. F. Zhang. A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction[J]. Journal of Applied Physics,2009,106(11). |
| APA | H. F. Zou,H. J. Yang,&Z. F. Zhang.(2009).A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction.Journal of Applied Physics,106(11). |
| MLA | H. F. Zou,et al."A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction".Journal of Applied Physics 106.11(2009). |
入库方式： OAI收割
来源：金属研究所
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