Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate
文献类型：期刊论文
| 作者 | H. F. Zou ; Q. K. Zhang ; Z. F. Zhang |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2009 |
| 卷号 | 61期号:3页码:308-311 |
| 关键词 | Bi interfacial segregation Embrittlement Pb-free solder Interfacial strength Soldering copper grain-boundaries fracture boron chemistry ni3al |
| ISSN号 | 1359-6462 |
| 中文摘要 | The segregation of Bi at the Cu/Cu(3)Sn interfaces of the SnBi/Cu couple dramatically decreases this couple's mechanical properties. Here, we deliberately add Ag, Al, Sn and Zn elements into the Cu substrate to eliminate the interfacial segregation and embittlement of the SnBi/Cu couple. Experimental results confirmed that there is always a perfect Cu(3)Sn/Cu alloy interface without Bi segregation, and excellent mechanical properties are thus maintained. The most important finding is that the interfacial embrittlement of SnBi/Cu alloy joints was successfully eliminated even after prolonged aging. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32643]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. F. Zou,Q. K. Zhang,Z. F. Zhang. Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate[J]. Scripta Materialia,2009,61(3):308-311. |
| APA | H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2009).Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate.Scripta Materialia,61(3),308-311. |
| MLA | H. F. Zou,et al."Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate".Scripta Materialia 61.3(2009):308-311. |
入库方式： OAI收割
来源：金属研究所
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