Strain hardening behavior of ultrafine-grained Cu by analyzing the tensile stress-strain curve
文献类型：期刊论文
| 作者 | C. X. Huang ; S. D. Wu ; S. X. Li ; Z. F. Zhang |
| 刊名 | Advanced Engineering Materials
 |
| 出版日期 | 2008 |
| 卷号 | 10期号:5页码:434-438 |
| 关键词 | severe plastic-deformation dual-phase steels nanostructured metals rate sensitivity ductility copper nanocrystalline temperature strength microstructure |
| ISSN号 | 1438-1656 |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32828]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | C. X. Huang,S. D. Wu,S. X. Li,et al. Strain hardening behavior of ultrafine-grained Cu by analyzing the tensile stress-strain curve[J]. Advanced Engineering Materials,2008,10(5):434-438. |
| APA | C. X. Huang,S. D. Wu,S. X. Li,&Z. F. Zhang.(2008).Strain hardening behavior of ultrafine-grained Cu by analyzing the tensile stress-strain curve.Advanced Engineering Materials,10(5),434-438. |
| MLA | C. X. Huang,et al."Strain hardening behavior of ultrafine-grained Cu by analyzing the tensile stress-strain curve".Advanced Engineering Materials 10.5(2008):434-438. |
入库方式： OAI收割
来源：金属研究所
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