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Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures
文献类型：期刊论文
| 作者 | Y. S. Li ; N. R. Tao ; K. Lu |
| 刊名 | Acta Materialia
 |
| 出版日期 | 2008 |
| 卷号 | 56期号:2页码:230-241 |
| 关键词 | nanostructured materials copper dynamic plastic deformation deformation twinning shear banding mechanical attrition treatment grain-refinement shear bands single-crystals large strains metals cu recrystallization strength nickel |
| ISSN号 | 1359-6454 |
| 中文摘要 | The microstructural evolution and formation mechanism of nanostructures in bulk pure Cu samples induced by dynamic plastic deformation (DPD) at high strain rates and cryogenic temperatures were investigated using transmission electron microscopic characterization. Three different mechanisms were identified for the plastic deformation and microstructural refinement, including dislocation manipulation and rearrangement, deformation twinning forming nanoscale twin/matrix (T/M) lamellae in bundles, and shear banding in the T/M lamellae. An increasing tendency of deformation twinning and shear banding was observed at higher strains. For strain epsilon=2.1, a mixed nanostructure is formed in the DPD Cu bulk sample with nanoscale T/M lamellae making up about 33% of the volume and nano-sized grains making up about 67%. The nanograins can be classified into three types in terms of their origin: (i) nanograins derived from fragmentation of nanoscale T/M lamellae with an average transverse size of about 47 nm; (ii) nanograins in shear bands with an average transverse size of about 75 nm, and (iii) nanograins derived from dislocation cells with an average transverse size of about 121 nm. The high density of deformation twins induced by high strain rates and cryogenic temperatures in DPD, distinct from that in conventional severe plastic deformation, plays a crucial role in formation of the nano-sized grains. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32908]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. S. Li,N. R. Tao,K. Lu. Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures[J]. Acta Materialia,2008,56(2):230-241. |
| APA | Y. S. Li,N. R. Tao,&K. Lu.(2008).Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures.Acta Materialia,56(2),230-241. |
| MLA | Y. S. Li,et al."Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures".Acta Materialia 56.2(2008):230-241. |
入库方式： OAI收割
来源：金属研究所
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