Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation
文献类型：期刊论文
| 作者 | Y. S. Li ; Y. Zhang ; N. R. Tao ; K. Lu |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2008 |
| 卷号 | 59期号:4页码:475-478 |
| 关键词 | nanostructure copper annealing mechanical properties dynamic plastic deformation (DPD) nano-scale twins ductility strength metals iron |
| ISSN号 | 1359-6462 |
| 中文摘要 | Thermal annealing of a nanostructured Cu sample processed by means of dynamic plastic deformation (DPD) induces static recrystallization (SRX) accompanied by a drop in strength and enhanced ductility. An obvious increment in tensile uniform elongation appears when the volume fraction of SRX grains exceeds 80%. The strength-ductility combination of the annealed nanostructured samples is superior to that of strain-induced ultrafine-grained Cu, owing to the finer grains and the presence of nanoscale twin bundles generated from the DPD. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/32909]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. S. Li,Y. Zhang,N. R. Tao,et al. Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation[J]. Scripta Materialia,2008,59(4):475-478. |
| APA | Y. S. Li,Y. Zhang,N. R. Tao,&K. Lu.(2008).Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation.Scripta Materialia,59(4),475-478. |
| MLA | Y. S. Li,et al."Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation".Scripta Materialia 59.4(2008):475-478. |
入库方式： OAI收割
来源：金属研究所
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