中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
The effect of twin plane spacing on the deformation of copper containing a high density of growth twins

文献类型:期刊论文

作者Z. W. Shan ; L. Lu ; A. M. Minor ; E. A. Stach ; S. X. Mao
刊名Jom
出版日期2008
卷号60期号:9页码:71-74
关键词nano-scale twins nanocrystalline nickel rate sensitivity metals boundaries mechanism al
ISSN号1047-4838
中文摘要In-situ tensile straining in a transmission electron microscope was used to investigate the role of twin plane spacing on the deformation and fracture mechanism of pure copper containing a high densin: of nanoscale growth twins. Real-time and post-mortem observations clearly reveal that twin plane spacing plays a key role in determining the operative deformation mechanism and therefore the subsequent crack propagation path. The deformation mechanism transition, which results front changes in the twin plane spacing, has implications for interpreting the unusual mechanical behavior of the copper with a high density of nanoscale growth twins.
原文出处://WOS:000259122300012
公开日期2012-04-13
源URL[http://210.72.142.130/handle/321006/33064]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
Z. W. Shan,L. Lu,A. M. Minor,et al. The effect of twin plane spacing on the deformation of copper containing a high density of growth twins[J]. Jom,2008,60(9):71-74.
APA Z. W. Shan,L. Lu,A. M. Minor,E. A. Stach,&S. X. Mao.(2008).The effect of twin plane spacing on the deformation of copper containing a high density of growth twins.Jom,60(9),71-74.
MLA Z. W. Shan,et al."The effect of twin plane spacing on the deformation of copper containing a high density of growth twins".Jom 60.9(2008):71-74.

入库方式: OAI收割

来源:金属研究所

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