Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu
文献类型：期刊论文
| 作者 | P. J. Shang ; Z. Q. Liu ; D. X. Li ; J. K. Shang |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2008 |
| 卷号 | 59期号:3页码:317-320 |
| 关键词 | Cu(3)Sn growth interface soldering transmission electron microscopy (TEM) lead-free solders diffusion couples snpb bi temperature systems joints copper phase |
| ISSN号 | 1359-6462 |
| 中文摘要 | The growth mechanisms Of Cu(3)Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (100) Cu the interfacial reaction-during reflow resulted in a columnar growth Of Cu(3)Sn along Cu [100] with a special crystallographic relationship of (210)(Cu3Sn)parallel to(402)(Cu)parallel to and [122](Cu3Sn)parallel to[010](Cu). In the subsequent solid-state aging new triangular COri grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent COri grains. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/33065]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | P. J. Shang,Z. Q. Liu,D. X. Li,et al. Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu[J]. Scripta Materialia,2008,59(3):317-320. |
| APA | P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2008).Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu.Scripta Materialia,59(3),317-320. |
| MLA | P. J. Shang,et al."Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu".Scripta Materialia 59.3(2008):317-320. |
入库方式： OAI收割
来源：金属研究所
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