Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints
文献类型：期刊论文
| 作者 | P. J. Shang ; Z. Q. Liu ; D. X. Li ; J. K. Shang |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2008 |
| 卷号 | 58期号:5页码:409-412 |
| 关键词 | eutectic SnBi alloy soldering interface segregation transmission electron microscopy (TEM) lead-free solders sn-bi segregation cu reliability bismuth |
| ISSN号 | 1359-6462 |
| 中文摘要 | Transmission electron microscopy evidence was obtained to elucidate the mechanism for Bi-induced interfacial void formation in solder joints. After thermal aging, Bi segregated to the Cu3Sn/Cu to form fine particles on the interface in SnBi/Cu solder joints. Interfacial voids were found near the interfacial Bi particles. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/33066]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | P. J. Shang,Z. Q. Liu,D. X. Li,et al. Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints[J]. Scripta Materialia,2008,58(5):409-412. |
| APA | P. J. Shang,Z. Q. Liu,D. X. Li,&J. K. Shang.(2008).Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints.Scripta Materialia,58(5),409-412. |
| MLA | P. J. Shang,et al."Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints".Scripta Materialia 58.5(2008):409-412. |
入库方式： OAI收割
来源：金属研究所
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