Tensile and fatigue strength of ultrathin copper films
文献类型：期刊论文
| 作者 | G. P. Zhang ; K. H. Sun ; B. Zhang ; J. Gong ; C. Sun ; Z. G. Wang |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2008 |
| 卷号 | 483-84页码:387-390 |
| 关键词 | metal film yield strength fatigue lifetime nano-sized grain size effect thin-films cyclic deformation behavior foils size |
| ISSN号 | 0921-5093 |
| 中文摘要 | Tensile and fatigue tests of ultrathin Cu films were conducted using a micro-force testing system. Fatigue strength as a function of film thickness was measured under the constant total strain range control at a frequency of 10 Hz. The experimental results exhibit that both yield strength and fatigue lifetime are dependent on film thickness. Fatigue damage behavior in the 100 nm thick Cu films with nanometer-sized grains is different from that in the micrometer-thick Cu films with large grains observed before. A comparison of the present results with those reported in literatures is conducted. Possible fatigue strengthening mechanism in the ultrathin Cu films is discussed. (c) 2007 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/33310]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | G. P. Zhang,K. H. Sun,B. Zhang,et al. Tensile and fatigue strength of ultrathin copper films[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2008,483-84:387-390. |
| APA | G. P. Zhang,K. H. Sun,B. Zhang,J. Gong,C. Sun,&Z. G. Wang.(2008).Tensile and fatigue strength of ultrathin copper films.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,483-84,387-390. |
| MLA | G. P. Zhang,et al."Tensile and fatigue strength of ultrathin copper films".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 483-84(2008):387-390. |
入库方式： OAI收割
来源：金属研究所
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