Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites
文献类型：期刊论文
| 作者 | J. Zhang ; Y. C. Zhou |
| 刊名 | Journal of Materials Research
 |
| 出版日期 | 2008 |
| 卷号 | 23期号:4页码:924-932 |
| 关键词 | liquid reaction synthesis copper matrix composites polycrystalline ti3sic2 ti3alc2 stability deformation ceramics behavior ti2snc alloys |
| ISSN号 | 0884-2914 |
| 中文摘要 | Two kinds of composites (i.e., conductive and strong Cu-Ti3AlC2 composites) were prepared at 850 degrees C, while high-strength in situ Cu-TiCx composites were prepared by consolidation at 850 degrees C and then hot pressing at 1000 degrees C. In both kinds of composites, the reinforcements were uniformly distributed within the Cu matrix. In Cu-Ti3AlC2 composites, strengthening was achieved by the load transfer through a strong interfacial layer consisting of TiCx and Cu(Al), which was formed by the partial deintercalation of Al from Ti3AlC2. For the in situ Cu-TiCx composites, the higher modulus of TiCx as well as the highly twinned structure formed during processing contributed to the enhancement of strength. It was demonstrated that the deintercalation of Al from Ti3AlC2 formed substoichiometric Ti3AlC2 (With x < 1), and no detrimental effect on the electrical conductivity was observed. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/33321]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | J. Zhang,Y. C. Zhou. Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites[J]. Journal of Materials Research,2008,23(4):924-932. |
| APA | J. Zhang,&Y. C. Zhou.(2008).Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites.Journal of Materials Research,23(4),924-932. |
| MLA | J. Zhang,et al."Microstructure, mechanical, and electrical properties of Cu-Ti3AlC2 and in situ Cu-TiCx composites".Journal of Materials Research 23.4(2008):924-932. |
入库方式： OAI收割
来源：金属研究所
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