Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect
文献类型：期刊论文
| 作者 | X. F. Zhang ; J. D. Guo ; J. K. Shang |
| 刊名 | Journal of Materials Research
 |
| 出版日期 | 2008 |
| 卷号 | 23期号:12页码:3370-3378 |
| 关键词 | ni-p/au layer interfacial reactions cu indium films tin |
| ISSN号 | 0884-2914 |
| 中文摘要 | Polarity effect on the interfacial reactions from high-density electric currents was investigated in a solder interconnect with a large disparity in the effective charge between the solder constituents. A reverse polarity effect was found where the intermetallic compound layer at the cathode grew significantly thicker than that at the anode under electric loading. Such an abnormal polarity effect was shown to result from electromigrations of Sn and Zn along opposite directions as dictated by the disparity in their effective charges. As Sn migrated to the anode under electron wind force, the resulting back stress drove Zn atoms to drift to the cathode. A kinetic analysis of the Zn mass transport explained the differential growth of the intermetallic compounds at the two electrodes, in good agreement with the experimental data. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/33346]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect[J]. Journal of Materials Research,2008,23(12):3370-3378. |
| APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2008).Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect.Journal of Materials Research,23(12),3370-3378. |
| MLA | X. F. Zhang,et al."Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect".Journal of Materials Research 23.12(2008):3370-3378. |
入库方式： OAI收割
来源：金属研究所
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